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this is information on a product in full production. march 2014 docid022777 rev 2 1/12 hsp061-2 2-line esd protection for high speed lines datasheet - production data figure 1. functional schematic (top view) features ? flow-through routing to keep signal integrity ? ultralarge bandwidth: 6 ghz ? ultralow capacitance: 0.6 pf ? low leakage current: 100 na at 25 c ? extended operating junction temperature range: -40 c to 150 c ? rohs compliant benefits ? high esd robustness of the equipment ? suitable for high density boards complies with following standards ? mil-std 883g method 3015-7 class 3b: ?8 kv ? iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 8 kv (contact discharge) applications the hsp061-2 series is designed to protect against electrostatic discharge on sub micron technology circuits driving: ? hdmi 1.3 and 1.4 ? digital video interface ? display port ? usb 3.0 ? serial ata ? ethernet ? hmi description the hsp061-2 is a 2-channel esd array with a rail to rail architecture designed specifically for the protection of high speed differential lines. the ultralow variation of the capacitance ensures very low influence on signal-skew. the large bandwidth makes it compatible with 5 gbps. the hsp061-2p6 is housed in sot-666. the HSP061-2M6 is packaged in qfn-6l (1.45 x 1.0 mm) with a 500 m pitch. the hsp061-2n4 is packaged in qfn-4l (1.0 x 0.8 mm) with a 400 m pitch. HSP061-2M6 qfn-6l hsp061-2n4 qfn-4l hsp061-2p6 sot-666 1 6 2 5 3 4 i/o1 i/o1 gnd v bus i/o2 i/o2 1 16 2 5 3 4 i/o1 i/o1 gnd v bus i/o2 i/o2 qfn 6 leads qfn 4 leads sot666 i/o1 nc gnd i/o2 nc www.st.com
characteristics hsp061-2 2/12 docid022777 rev 2 1 characteristics table 1. absolute maximum ratings t amb = 25 c symbol parameter value unit v pp peak pulse voltage iec 61000-4-2 contact discharge 8 kv iec 61000-4-2 air discharge 15 i pp repetitive peak pulse current (8/20 s) 3 a t j operating junction temperature range -40 to +150 c t stg storage temperature range -65 to +150 c t l maximum lead temperature for soldering during 10 s 260 c table 2. electrical characteristics t amb = 25 c symbol parameter test conditions min. typ. max. unit v br breakdown voltage i r = 1 ma 6 v i rm leakage current v rm = 3 v 100 na v cl clamping voltage iec 61000-4-2, +8 kv contact (i pp = 30 a), measured at 30 ns 18 v c i/o - gnd capacitance (input/output to ground) v i/o = 0 v, f = 200 to 3000 mhz, v osc = 30 mv 0.6 0.85 pf c i/o - gnd capacitance variation (input/output to ground) v i/o = 0 v f = 200 to 3000 mhz, v osc = 30 mv 0.03 0.13 pf f c cut-off frequency -3 db HSP061-2M6, hsp061-2p6 5.5 ghz hsp061-2n4 6
docid022777 rev 2 3/12 hsp061-2 characteristics 12 figure 2. leakage current versus junction temperature (typical values) figure 3. s21 attenuation measurement (hsp061-2p6, HSP061-2M6) tj (c) 0.01 0.10 1.00 10.00 25 50 75 100 125 150 i r (na) v r =v rm = 3 v s21(db) 300.0k 1.0m 3.0m 10.0m 30.0m 100.0m 300.0m 1.0g 3.0g - 16.00 - 12.00 - 8.00 - 4.00 0.00 f(hz) figure 4. s21 attenuation measurement (hsp061-2n4) figure 5. eye diagram - hdmi mask at 3.4 gbps per channel (1) (hsp061-2p6) 1. hdmi specification conditions. this inform ation can be provided for other applications . please contact your local st office. figure 6. eye diagram - hdmi mask at 3.4 gbps per channel (1) (HSP061-2M6) figure 7. eye diagram - hdmi mask at 3.4 gbps per channel (1) (hsp061-2n4) 300k 1m 3m 10m 30m 100m 300m 1g 3g -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 io1 io2 s21 (db) f (hz) 250 mv/div 49 ps/div 250 mv/div 49 ps/div 250 mv/div 49 ps/div
ordering information scheme hsp061-2 4/12 docid022777 rev 2 2 ordering information scheme figure 10. ordering information scheme figure 8. esd response to iec 61000-4-2 (+8 kv contact discharge) figure 9. esd response to iec 61000-4-2 (-8 kv contact discharge) 10v/div 100ns/div 10v/div 100ns/div hsp 06 1 - 2 xx high speed line protection breakdown voltage version number of lines package p6 = sot-666 m6 = qfn-6l n4 = qfn-4l
docid022777 rev 2 5/12 hsp061-2 package information 12 3 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 3. sot-666 dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.45 0.60 0.018 0.024 a3 0.08 0.18 0.003 0.007 b 0.17 0.34 0.007 0.013 b1 0.19 0.27 0.34 0.007 0.011 0.013 d 1.50 1.70 0.059 0.067 e 1.50 1.70 0.059 0.067 e1 1.10 1.30 0.043 0.051 e 0.50 0.020 l1 0.19 0.007 l2 0.10 0.30 0.004 0.012 l3 0.10 0.004 figure 11. footprint recommendations dimensions in mm (inches) figure 12. marking for sot-666 d b l3 l1 e b1 e1 l2 e a a3 0.50 (0.019) 2.60 (0.01) 0.62 (0.024) 0.30 (0.012) 0.99 (0.039) r
package information hsp061-2 6/12 docid022777 rev 2 note: product marking may be rotated by 90 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. table 4. qfn 1.45x1.00 6l dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.50 0.55 0.60 0.020 0.022 0.024 a1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.18 0.25 0.30 0.007 0.010 0.012 d 1.45 0.057 e 1.00 0.039 e 0.50 0.020 k 0.20 0.008 l 0.30 0.35 0.40 0.012 0.014 0.016 figure 13. footprint recommendations dimensions in mm (inches) figure 14. marking for qfn 1.45x1.00 6l e d a a1 e b k l n 1 1 2 2 0.50 [0.020] 0.25 [0.010] 0.65 [0.026] 0.30 [0.012] 1.60 [0.063] t
docid022777 rev 2 7/12 hsp061-2 package information 12 note: product marking may be rotated by 90 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. table 5. qfn- 4l dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.45 0.50 0.55 0.018 0.020 0.022 a1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 d 0.75 0.80 0.85 0.030 0.031 0.033 d2 0.55 0.6 0.65 0.022 0.024 0.026 e 0.35 0.40 0.45 0.014 0.016 0.018 e 0.95 1.00 1.05 0.037 0.039 0.041 e2 0.15 0.20 0.25 0.006 0.008 0.010 k 0.17 0.20 0.23 0.007 0.008 0.009 l 0.15 0.20 0.25 0.006 0.008 0.010 figure 15. footprint recommendations (dimensions in mm) figure 16. marking for qfn- 4l a a1 d e k d2 e e2 b l bottom view side view 0.4 (0.016) 0.4 (0.016) 0.2 (0.008) 0.2 (0.008) 0.6 (0.024) 1.4 (0.055) pin 1 1
recommendation on pcb assembly hsp061-2 8/12 docid022777 rev 2 4 recommendation on pcb assembly 4.1 stencil opening design 1. general recommendation on stencil opening design a) stencil opening dimensions: l (length), w (width), t (thickness). figure 17. stencil opening dimensions b) general design rule stencil thickness (t) = 75 ~ 125 m 2. reference design a) stencil opening thickness: 100 m b) stencil opening for leads: opening to footprint ratio is 90%. figure 18. recommended stencil window position for qfn-6l l t w aspect ratio w t ----- 1.5 = aspect area lw 2t l w + () --------------------------- - 0.66 = 250 m 650 m 620 m 236 m 15 m 15 m 7m 7m footprint stencil window footprint
docid022777 rev 2 9/12 hsp061-2 recommendation on pcb assembly 12 figure 19. recommended stencil window position for qfn-4l 4.2 solder paste 1. halide-free flux qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste is recommended. 3. offers a high tack force to resist component movement during high speed. 4. solder paste with fine particles: powder particle size is 20-45 m. 4.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placement system, not the outline centering. 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force 180 m footprint footprint t=100 m and opening ratio is 100% 580 m 200 m 430 m stencil windo w 0.4 0.4 0.2 0.2 0.6 0.6 1.4
recommendation on pcb assembly hsp061-2 10/12 docid022777 rev 2 can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 4.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. 4.5 reflow profile figure 20. st ecopack? recommended sold ering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max
docid022777 rev 2 11/12 hsp061-2 ordering information 12 5 ordering information 6 revision history table 6. ordering information order code marking package weight base qty delivery mode hsp061-2p6 r sot-666 2.85 mg 3000 tape and reel (7?) HSP061-2M6 t (1) 1. the marking can be rotated by multiple of 90 to differentiate assembly location qfn-6l 2.3 mg 3000 tape and reel (7?) hsp061-2n4 1 (1) qfn-4l 1.17 mg 10000 tape and reel (7?) table 7. document revision history date revision changes 07-feb-2012 1 initial release. 19-mar-2014 2 minor text changes.
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